by Chris DePuy, 650 Group / October 8, 2026
Infineon introduced a 27 kW three-phase power supply unit reference design for AI server racks on Thursday, ahead of next week’s OCP Global Summit in San Jose. The design targets the shift in AI data centers toward 800 VDC and ±400 VDC rack architectures as rack densities climb, and it meets the OCP ORV3 specification.
The company detailed a five-level ANPC PFC topology paired with a three-level LLC converter, built from 650 V CoolSiC and CoolMOS MOSFETs, EiceDRIVER gate drivers, XENSIV current sensors, and PSOC Control C3 microcontrollers running a programmable power control accelerator. The unit posts peak efficiency above 98 percent at 480 VAC and 50 percent load, and its 116 W/in³ power density beats the ORV3 floor of 94 W/in³.
A built-in energy buffer holds output through 20 milliseconds of grid disturbance and smooths line voltage through rapid GPU load transients, removing a separate capacitor bank from the bill of materials. Input spans 311 to 528 VAC three-phase with a power factor above 0.99.
We’re bullish on AI factory capital spending, and Infineon is one of the vendors that benefits twice: silicon content per rack rises as GPUs multiply, and power density becomes the design axis that decides who wins slots in the rack. We think these 27 kW units point to rack builds around ~108 kW on the path toward megawatt-class racks — power, not GPUs, is becoming the constraint.
650 Group researches several of the technologies we covered in this blog, including Data Center Co-Location & Cloud, Enterprise, and more.
